Methods Of Adding Pads And One Or More Interconnect Layers To The Passivated Topside Of A Wafer Including Connections To At Least A Portion Of The Integrated Circuit Pads Thereon

ABSTRACT

A pattern of conductive ink is disposed on the topside of the unsingulated integrated circuits of a wafer, and, typically after wafer probing, the pattern of conductive ink is removed. The conductive ink pattern provides an electrical pathway between bond pads on an integrated circuit and large contact pads disposed on the topside of the integrated circuit. Each of the large contact pads is much greater in area than the corresponding bond pads, and are spaced apart so that the pitch of the large contact pads is much greater than that of the bond pads. In one aspect of the present invention, the conductive ink includes a mixture of conductive particles and wafer bonding thermoset plastic. In another aspect of the present invention, the conductive ink is heated and disposed on a wafer by an ink jet printing system.

RELATED APPLICATIONS

This application claims the benefit of Provisional Application No.61/113,544, filed 11 Nov. 2008, and entitled “A Method of Adding One orMore Layers of Conductive Traces and Pads To The Surface of a FullyManufactured Wafer Including Connection To All Or A Selected Sub Set ofthe Pads On the Die Within the Wafer”, the entirety of which is herebyincorporated by reference.

FIELD OF THE INVENTION

The present invention relates generally to semiconductor manufacturing,and more particularly relates to methods for providing electricalpathways between the pads of integrated circuits on a wafer andcircuitry external to the wafer.

BACKGROUND

Advances in semiconductor manufacturing technology have resulted in,among other things, reducing the cost of sophisticated electronics tothe extent that integrated circuits have become ubiquitous in the modernenvironment.

As is well-known, integrated circuits are typically manufactured inbatches, and these batches usually contain a plurality of semiconductorwafers within and upon which integrated circuits are formed through avariety of semiconductor manufacturing steps, including, for example,depositing, masking, patterning, implanting, etching, and so on.

Completed wafers are tested to determine which die, or integratedcircuits, on the wafer are capable of operating according topredetermined specifications. In this way, integrated circuits thatcannot perform as desired are not packaged, or otherwise incorporatedinto finished products.

It is common to manufacture integrated circuits on roughly circularsemiconductor substrates, or wafers. Further, it is common to form suchintegrated circuits so that conductive regions disposed on, or close to,the uppermost layers of the integrated circuits are available to act asterminals for connection to various electrical elements disposed in, oron, the lower layers of those integrated circuits. These conductiveregions are commonly referred to as pads, or bond pads. During testing,which is often referred to as wafer probing or wafer sorting, the padsare commonly contacted with a probe card. Such wafer probing typicallyincludes mounting the wafer on a moveable chuck that is used to positionthe wafer relative to a probe card and to hold the wafer in place duringtesting.

As the physical dimensions of integrated circuits continue to shrink,the pad size and pad pitch have also been shrinking. Consequently, ithas become more difficult and costly to manufacture and maintain probecards that are capable contacting integrated circuits with small padswith tight pad pitch.

What is needed are methods and structures for reducing the need for highprecision and high maintenance probe cards.

SUMMARY OF THE INVENTION

Briefly, a pattern of conductive ink is disposed on the topside of theunsingulated integrated circuits of a wafer, and, typically after waferprobing, the pattern of conductive ink is removed. The conductive inkpattern provides an electrical pathway between bond pads on anintegrated circuit and large contact pads disposed on the topside of theintegrated circuit. Each of the large contact pads is much greater inarea than the corresponding bond pads, and are spaced apart so that thepitch of the large contact pads is much greater than that of the bondpads.

In one aspect of the present invention, the conductive ink includes amixture of conductive particles and wafer bonding thermoset plastic.

In another aspect of the present invention, the conductive ink is heatedand disposed on a wafer by an ink jet printing system.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional representation of a portion of a waferduring deposition of a conductive ink over a bond pad of an integratedcircuit.

FIG. 2 shows the structure of FIG. 1 subsequent to the deposition step,and wherein the conductive spheres of the conductive ink have settledinto the predetermined pattern.

FIG. 3 shows the structure of FIG. 2 subsequent to cooling which causesthe conductive spheres to pack more closely together.

FIG. 4 is a cross-sectional representation of a portion of a wafer whereconductive ink has been deposited over a passivated portion of thesurface of the wafer, that is an area spaced apart from a bond pad of anintegrated circuit.

FIG. 5 shows the structure of FIG. 4 after heating and during flow of asolvent across the wafer to remove the previously deposited conductiveink.

FIG. 6 is similar to FIG. 5, and shows the continuation of theconductive ink removal process.

FIG. 7 is a top view of a wafer that has been aligned to an ink jetprinter system which can deliver conductive ink compounds.

FIG. 8 is a top view of a wafer wherein the ink jet printer system hasbegun printing conductive lines connected to the bond pads of theintegrated circuits.

FIG. 9 is a top view of the wafer of FIG. 8, wherein the ink jet printersystem continues to print conductive lines connected to the bond pads ofthe integrated circuits.

FIG. 10 is a top view of the wafer of FIG. 9 wherein the ink jet printersystem has completed printing conductive lines connected to the bondpads of the integrated circuits.

FIG. 11 is a top view of the wafer of FIG. 10 as the ink jet printersystem begins a second pass of printing conductive ink, this time toform contact pads that are significantly larger than the bonding pads ofthe integrated circuits.

FIG. 12 is a top view of the wafer of FIG. 11 wherein the ink jetprinter system continues to print large contact pads.

FIG. 13 is a top view of the wafer of FIG. 12 wherein the ink jetprinter system has completed printing large contact pads across thewafer.

FIG. 14 is a top view of a wafer having interconnections and large padsprinted thereon, and an indication of where the large contact pads onone integrated circuit are contacted during wafer probing.

FIG. 15 is similar to FIG. 14, but shows where all the large contactpads are contacted during wafer probe.

DETAILED DESCRIPTION

Reference herein to “one embodiment”, “an embodiment”, or similarformulations, means that a particular feature, structure, operation, orcharacteristic described in connection with the embodiment, is includedin at least one embodiment of the present invention. Thus, theappearances of such phrases or formulations herein are not necessarilyall referring to the same embodiment. Furthermore, various particularfeatures, structures, operations, or characteristics may be combined inany suitable manner in one or more embodiments.

Terminology

The terms chip, integrated circuit, semiconductor device, andmicroelectronic device are sometimes used interchangeably in this field.The present invention relates to the manufacture and test of chips,integrated circuits, semiconductor devices and microelectronic devicesas these terms are commonly understood in the field.

The present invention relates to a method of adding one or more layersof conductive traces and pads to the surface of a fully manufacturedwafer including connection to all or a selected subset of the pads onthe die within the wafer. Starting with a finished semiconductor wafer(of any product) that has a topside passivation layer with openings thatexpose at least a portion of the contact pads, the wafer is aligned to asystem that applies the desired pattern of connections between thecontact pads and a corresponding set of large pads disposed over thetopside passivation layer. These can be stencil printing in a mannersimilar to solder pasted, ink jet printed from equipment meant to printconductive inks or liquids or by other means that exist for applying andpatterning materials on wafers. In an illustrative embodiment, a mixtureof wafer bonding plastic and conductive nano-particles is applied instages with an ink jet printer to yield a pattern of “wires” between thebond pads and the large contact pads over the balance of the die forlater contact with probes, pogo pins or even inexpensive large pitchprobe cards. The mixture may be conductive nano-particles and thermo setplastic (such as Brewer Scientific wafer bonding material).

The mixture is applied hot, and upon cooling, the bonding plasticshrinks to pull the metallic particles into contact with each other andwith the exposed contact pads. Adhesion of the bonding plastic to thewafer surface causes most shrinkage to be in the Z-axis, rather than inthe X- or Y- (i.e., horizontal) axes, thereby preserving thetwo-dimensional (2D) shape of the features.

The surface of the big pads may require some penetration to reach theconductive elements but most probes will automatically provide thisfunction.

After probing with the lower cost equipment and processes enabled by thelarge pads, the material is heated and dissolved away, thereby restoringthe wafer surface to a pre-tested condition.

These steps produce a robust, large pitch and large area pad set toenable wafer testing with greater parallelism and lower cost equipmentand processes.

When carried out properly the wafer can be probed many times to performmany tests, and when completed, the contact pads have virtually no marksor damage. This will increase assembly yield and allow more testingwithout risk of damage to the contact pads. This is critical inmulti-chip packages where yield of the wire bonds is critical and KnownGood Die are required. For example, the composite material can be apremixed conductive elastomer that is applied, cured and is at allstages conductive.

Another example is a mixture of conductive particles in a dielectricmatrix that is made conductive in a desired pattern by exposing thematerial with a laser to cause shrinkage as described earlier; sinteringof the metallic particles to create connections; or triggering chemicalchanges with a laser to cause cross-linking to make a conductivepolymer.

The materials previously listed can be exchanged to modify thedurability of the conductive phase or can in fact be made permanent onthe surface of the wafer. Other manifestations can be used to bondwafers together with conductive pathways between or among wafers eitherpermanently of temporarily.

Various embodiments of the present invention provide a method ofdisposing and removing at least one patterned layer of conductivematerial on the circuit side of a wafer, the patterned layer providingconductive pathways between contact pads and a corresponding set oflarge pads, thereby enabling conventional low-cost probes and probesystems to contact the large pads while being electrically coupled tothe contact pads, which are significantly smaller in area than the largepads. After electrical tests are performed, the at least one patternedconductive layer is removed, leaving tested dice on the wafer, each diehaving contact pads that are undamaged by testing.

An illustrative method of adding one or more layers of conductive tracesand pads to the surface of a fully manufactured wafer includingconnection to all or a selected subset of the contact pads on the diewithin the wafer is described below. Conductive metal nano-particles aremixed in correct proportion (e.g., 40% to 50%) with an existingthermoset plastic commonly used to bond wafers together for a waferthinning operation. This mixture is applied hot to the wafer in apattern that connects the existing contact pads on the wafer to muchlarger, easier to contact conductive pads disposed over the surface ofthe topside passivation layer of the wafer, wherein those large pads arealso formed from the deposited mixture. This mixture has a highCoefficient of Thermal Expansion (CTE), and upon cooling, the metalparticles are pulled against each other and against the metal surface ofthe contact pads to create a conductive surface, i.e., the large pads,which are electrically coupling to the contact pads. These large padsare typically 300 to 500 times the area of the contact pads. When waferprobing is finished, the wafer is heated and the mixture is removed witha flowing solvent. No residue, or substantially no residue, remains onthe wafer since the material was not brought to its set temperature.Metallic components are reusable, as is the bonding material. Thislowers the cost of contacting full wafers for test.

FIGS. 1-16 show various stages of an illustrative method for addinglarge contact pads to the topside passivation layer of an unsingulatedwafer, the large contact pads coupled to the integrated circuit bondpads, testing the unsingulated integrated circuits on the wafer by wayof electrical communication through the large contact pads, and removingthe large contact pads and associated connections to the bonding pads.

FIG. 1 is a cross-sectional representation of a portion of a waferduring deposition of a conductive ink over a bond pad of an integratedcircuit. A bonding pad 102, sometimes referred to as a chip pad, iscovered around its peripheral edges by a topside passivation layer 104.Bonding pad 102 is typically formed from a metal, a metal alloy, or astack of metals and/or metal alloys. Various materials, such as, oxides,nitrides, and polyimides, may be used as topside passivation layers. Thepresent invention is not limited to any particular composition of thetopside passivation layer. FIG. 1 further shows metallic nano-spheres106 having a bonding plastic coating 108 being deposited over bondingpad 102. In an illustrative embodiment, wafer bonding thermoset plasticis heated and mixed with conductive nano-spheres and then disposed onthe topside of the bonding pad. Such a mixture may be referred to as aconductive ink, since it can be applied in a manner similar to printing,and the resulting pattern is electrically conductive. Disposing theheated mixture on the wafer may be accomplished by ink jet, stenciling,or by coating the surface and then etching the desired pattern. Thedesired pattern is one which electrically connects to bonding pads 102with corresponding larger contact pads disposed on the topside of theintegrated circuit. The larger contact pads facilitate wafer probing byproviding large targets for probe cards and therefore less precision isneeded in constructing and maintaining the probe cards.

FIG. 2 shows the structure of FIG. 1 subsequent to the deposition step,and wherein the conductive spheres of the conductive ink have settledinto the predetermined pattern and are cooling.

FIG. 3 shows the structure of FIG. 2 subsequent to cooling which causesthe conductive spheres to pack more closely together. In thisillustrative embodiment, the conductive ink is characterized by a highcoefficient of thermal expansion (CTE). Cooling shrinks the high CTEmaterial, thereby forcing the metal nano-spheres into contact with eachother and with the metal bond pads.

FIG. 4 is a cross-sectional representation of a portion of a wafer whereconductive ink has been deposited over a passivated portion of thesurface of the wafer, that is, an area spaced apart from a bond pad ofan integrated circuit. A large contact pad 402 formed from thedeposition and cooling of conductive ink, is disposed on topsidepassivation layer 104. In this illustrative embodiment, large pad 402 is300 to 500 times greater in area than the bonding pads of the integratedcircuits. A probe structure 404 is shown in contact with large pad 402.After wafer probing, large pad 402, and all of the associated conductiveink previously deposited, are washed off, leaving the integrated circuittested and the bonding pads undamaged by contact with any probestructures.

FIG. 5 shows the structure of FIG. 4 after heating and during flow 502of a solvent across the wafer to remove the previously depositedconductive ink.

FIG. 6 is similar to FIG. 5, and shows the continuation of theconductive ink removal process.

FIG. 7 is a top view of a wafer that has been aligned to an ink jetprinter system which can deliver conductive ink mixtures. It can be seenthat a wafer 702 has a plurality of integrated circuits 704 thereon, andthat each integrated circuit 704 has a plurality of bond pads 708. Inthis illustrative embodiment, bond pads 708 are disposed in a single rowacross a center portion of each integrated circuit 704. Those skilled inthe field of integrated circuits will recognize that many differentlayouts, or arrangements, of the bond pads on an integrated circuit arepossible. The present invention is not limited to any particular layoutor arrangement of bond pads. Still referring to FIG. 7, it can be seenthat wafer 702 is aligned to the motion system of an ink jet printer710. Ink jet printer 710 is operable to deliver conductive ink compoundsto the topside of the wafer, including inks requiring heating in orderto be jetted to a surface. Ink jet printer 710 includes an ink jet printhead and ink supply subassembly 712. Ink jet print head and ink supplysubassembly 712 is movably mounted to a traveling member 711. Travelingmember 711 moves back and forth in the x-direction, and ink jet printhead and ink supply subassembly 712 moves back and forth in they-direction. In this way, the conductive ink can be delivered to anypoint on the wafer.

FIG. 8 is a top view of wafer 702 and ink jet printer system 710,wherein ink jet printer system 710 has begun printing conductive lines802 on integrated circuits 704, and conductive lines 802 are in contactwith bond pads 708 of integrated circuits 704. In this illustrativeembodiment, a first pass of the ink jet system prints conductive lines802, while a second pass (FIGS. 11-13) prints the large contact pads.

FIG. 9 shows the wafer of FIG. 8, wherein the ink jet printer systemcontinues to print conductive lines 802 connected to the bond pads ofthe integrated circuits.

FIG. 10 shows the wafer of FIG. 9 wherein the ink jet printer system hascompleted printing conductive lines 802 on the integrated circuits.

FIG. 11 is a top view of wafer 702 as ink jet printer system 710 beginsa second pass of printing conductive ink, this time to form a pluralityof large contact pads 1102. Large contact pads 1102 are placed so thatthey are in electrical connection with corresponding conductive lines802. It is noted that large contact pads 1102 are significantly largerthan bond pads 708 of integrated circuits 704. In typical embodiments,large contact pads 1102 are 300 to 500 times greater in area than bondpads 708. Similarly, in typical embodiments, the pitch of large contactpads 1102 is greater than the pitch of bond pads 708. Advantageously,the large pads and large pitch obtained with the present invention makedesigning and building a probe structure relatively easy. The presentinvention is not limited to any particular size or pitch for the largecontact pads.

FIG. 12 shows wafer 702 wherein the ink jet printer system 710 continuesto print large contact pads 1102.

FIG. 13 shows wafer 702 wherein the ink jet printer system 710 hascompleted printing large contact pads 1102 across the wafer 702.

FIG. 14 is a top view of wafer 702 having interconnections and largepads printed thereon, and an indication 1402 of where the large contactpads 1102 on one integrated circuit are contacted during wafer probing.

FIG. 15 is similar to FIG. 14, but shows where all the large contactpads are contacted during wafer probe.

An illustrative method, in accordance with the present inventionincludes, providing a wafer, the wafer having a plurality of integratedcircuits thereon and further having a patterned passivation layerdisposed thereon, the patterned passivation layer having openingstherethrough, each opening exposing at least a portion of an integratedcircuit pad; depositing conductive ink, in a first predeterminedpattern, over at least a portion of the exposed integrated circuit pads;and depositing conductive ink, in a second predetermined pattern, overat least a portion of the patterned passivation layer; wherein the firstpredetermined pattern includes conductive lines, the secondpredetermined pattern include large contact pads, and at least oneconductive line is electrically connected to at least one large pad.Some embodiments further include electrically coupling at least one ofthe plurality of large contact pads to a probe structure. Someembodiments further include heating the conductive ink on the wafer andwashing the wafer with a solvent.

An illustrative method of forming temporary contact terminals on thepassivated surface of integrated circuits on a wafer, includes providinga wafer, the wafer having a plurality of integrated circuits thereon andfurther having a patterned passivation layer disposed thereon, thepatterned passivation layer having openings therethrough, each openingexposing at least a portion of an integrated circuit pad; mixing waferbonding thermoset plastic and conductive particles; heating the mixtureof wafer bonding thermoset plastic and conductive particles; depositingthe mixture onto the wafer in a predetermined pattern; and cooling thedeposited mixture. Once the temporary contact terminals are formed,wafer probing may be performed. The temporary contact terminals can beremoved by heating the deposited mixture and exposing the heated mixtureto a solvent.

CONCLUSION

The exemplary apparatus illustrated and described herein findapplication in at least the field of integrated circuit test andanalysis.

It is to be understood that the present invention is not limited to theembodiments described above, but encompasses any and all embodimentswithin the scope of the subjoined Claims and their equivalents.

1. A method, comprising: providing a wafer, the wafer having a plurality of integrated circuits thereon and further having a patterned passivation layer disposed thereon, the patterned passivation layer having openings therethrough, each opening exposing at least a portion of an integrated circuit pad; depositing conductive ink, in a first predetermined pattern, over at least a portion of the exposed integrated circuit pads; and depositing conductive ink, in a second predetermined pattern, over at least a portion of the patterned passivation layer; wherein the first predetermined pattern includes conductive lines, the second predetermined pattern include large contact pads, and at least one conductive line is electrically connected to at least one large pad.
 2. The method of claim 1, further comprising: electrically coupling at least one of the plurality of large contact pads to a probe structure.
 3. The method of claim 2, further comprising: heating the conductive ink on the wafer and washing the wafer with a solvent.
 4. The method of claim 1, wherein depositing conductive ink comprises ink jet printing.
 5. The method of claim 2, further comprising performing at least one electrical test on at least one of the integrated circuits on the wafer.
 6. A method of forming temporary contact terminals on the passivated surface of integrated circuits on a wafer, comprising: providing a wafer, the wafer having a plurality of integrated circuits thereon and further having a patterned passivation layer disposed thereon, the patterned passivation layer having openings therethrough, each opening exposing at least a portion of an integrated circuit pad; mixing wafer bonding thermoset plastic and conductive particles; heating the mixture of wafer bonding thermoset plastic and conductive particles; depositing the mixture onto the wafer in a predetermined pattern; and cooling the deposited mixture.
 7. The method of claim 6, further comprising wafer probing.
 8. The method of claim 6, further comprising heating the deposited mixture and exposing the heated mixture to a solvent.
 9. The method of claim 7, further comprising heating the deposited mixture and exposing the heated mixture to a solvent. 